Step-by-Step Assembly

PETG warping on the base housing is usually caused by insufficient bed adhesion or drafts. Clean your build plate with isopropyl alcohol, apply a thin layer of glue stick, and ensure no drafts near the printer. If warping persists, add a brim (5-8mm) in your slicer. The base must sit flat on a table with no rocking before proceeding to assembly.

If your printer has 250mm+ build height, print the full dome for maximum structural strength (no glue joint). If your printer is the standard 220x220x220mm, use the split dome option. The split dome halves join with medium CA glue on the 1mm alignment step ring -- the bond is strong and nearly invisible when done correctly.

If vent caps are too tight, lightly sand the insertion body with 220-grit sandpaper. If too loose, reduce the fdm_tolerance parameter in cad/parameters.scad from 0.2mm to 0.1mm and reprint. Printing vent caps at 0.16mm layer height gives smoother snap-fit tabs for a better friction fit.

PLA works for initial test prints and fit checks, but it will soften and degrade in the sustained high-humidity environment (85-95% RH) inside the dome. PETG is strongly recommended for the final build. ABS is not recommended due to excessive warping on the large curved dome surfaces.

Base housing: 25% gyroid. Dome (full or split): 15% gyroid. Substrate platform: 20% gyroid. Vent caps: 100% solid (they are very small parts). Gyroid infill provides excellent strength-to-weight ratio and good moisture resistance for PETG prints.

Check three things: (1) Magnet orientation -- the magnet must be positioned at 0 degrees on the dome lip, directly above the reed switch in the base. (2) Distance -- the magnet must be within 10mm of the reed switch when the dome is seated. (3) Magnet strength -- ensure the 6x2mm neodymium magnet is fully seated in the pocket, not loose or shifted. Test with a multimeter in continuity mode.

Verify: (1) You are using logic-level MOSFETs (IRLZ44N) that saturate at 3.3V gate voltage. Standard MOSFETs will not fully turn on with ESP32 GPIO. (2) The 220 ohm gate resistor is connected between the ESP32 GPIO and the MOSFET gate. (3) MOSFET source is connected to the GND bus. (4) MOSFET drain is connected to the load. Check with a multimeter that the GPIO pin outputs ~3.3V when HIGH.

Run an I2C scanner sketch to verify the bus. Common fixes: (1) Check SDA (GPIO 21) and SCL (GPIO 22) connections. (2) Verify 3.3V power to the breakout board. (3) The BME280 address should be 0x76 or 0x77 -- some boards have an address jumper. (4) The breakout board should have on-board pull-ups; if not, add 4.7k ohm pull-ups to SDA and SCL.

Disconnect all power immediately. Use a multimeter to check: (1) No short between 5V rail and GND bus. (2) No short between GPIO pins and GND or VCC. (3) All MOSFET gate resistors read ~220 ohm. (4) No solder bridges between adjacent pins. Examine all solder joints under magnification if possible. Heat-shrink all bare connections.

Common fixes: (1) Make sure you're using a data-capable micro-USB cable, not a charge-only cable. (2) Install the correct USB-to-UART driver for your ESP32 variant (CP2102 or CH340). (3) Hold the BOOT button on the ESP32 during upload if auto-reset doesn't work. (4) Check that the correct COM port is selected in PlatformIO. (5) Try a different USB port or cable.

The default configuration creates its own WiFi access point: SSID 'VoidCore', password 'voidgrows'. Connect to this AP and access the dashboard at http://192.168.4.1. If you want to connect to your home WiFi instead, configure the credentials in the firmware's config.h file and re-upload. The ESP32 will fall back to AP mode if it can't connect to the configured network.

If temperature/humidity/pressure read zero: (1) Verify BME280 wiring (SDA to GPIO 21, SCL to GPIO 22, 3.3V power). (2) Check the serial monitor for I2C initialization errors. (3) Run the I2C scanner to confirm the sensor address (0x76 or 0x77). If readings are present but inaccurate, the BME280 may need a few minutes to stabilize after power-on. The sensor self-heats slightly, which is normal.

Connect the ESP32 via micro-USB and use PlatformIO to upload the new firmware (pio run -t upload). The Void Core firmware supports over-the-air (OTA) updates in future releases, but the initial prototype requires USB upload. Always check the serial monitor after flashing to verify the boot sequence completes successfully.

If using the Void Core with automated humidity: (1) Check that the humidifier disc is seated properly in the well and submerged in distilled water. (2) Verify the humidifier MOSFET (Q5, GPIO 13) is switching correctly. (3) Check the PID target humidity in the dashboard. For manual domes (Dark Dome, The Void), mist the interior 2-3 times daily and consider adding the optional silicone gasket O-ring for better humidity retention.

Contamination usually enters during inoculation or substrate preparation, not during fruiting. Prevention: (1) Run a UV-C sterilization cycle before placing new substrate. (2) Use sterile technique when handling substrate and spawn. (3) Ensure your substrate was properly pasteurized or sterilized before use. If contamination appears, remove the affected substrate immediately and sterilize the dome before starting a new grow.

Check environmental conditions: (1) Temperature should be in the species-specific range (typically 65-75F for most gourmet species). (2) Humidity should be 85-95% RH during fruiting. (3) Fresh air exchange is critical -- make sure vent caps are not sealed and the fan (Void Core) is running. (4) Light is not strictly required but helps trigger pinning -- use the UV-A or blue LED mode. (5) Patience: some species take 7-14 days to begin pinning after initiation.

Run a 15-minute UV-C sterilization cycle between grows (after harvesting and before placing new substrate). You do not need to run UV-C during active growing -- it would harm the mycelium. The UV-C LED targets contamination spores on dome surfaces and residual substrate material. Always verify the safety interlock before each use.